Intel HNS2600TP24STR server barebone Intel® C612 LGA 2011 (Socket R) Rack (1U)

Intel HNS2600TP24STR. Motherboard chipset: Intel® C612, Processor socket: LGA 2011 (Socket R), Intel Xeon series: E5-2600. Supported memory types: DDR4-SDRAM, Maximum internal memory: 1.02 GB, Supported RDIMM clock speeds: 1600,1866,2133,2400 MHz. Ethernet interface type: 10 Gigabit Ethernet, Gigabit Ethernet, Ethernet LAN data rates: 1000,10000 Mbit/s. Chassis type: Rack (1U)
Manufacturer: INTEL
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 4755331
Manufacturer part number: HNS2600TP24STR
Vendor: Synnex
$1,409.42
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Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection. Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection. Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.
Products specifications
Attribute nameAttribute value
Maximum internal memory1.02 GB
Intel Intelligent Power Node ManagerN
Intel Advanced Management TechnologyY
Intel Build Assurance TechnologyY
Intel Quiet Thermal TechnologyY
Intel Efficient Power TechnologyY
Intel Server Customization TechnologyY
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Products specifications
Attribute nameAttribute value
Maximum internal memory1.02 GB
Intel Intelligent Power Node ManagerN
Intel Advanced Management TechnologyY
Intel Build Assurance TechnologyY
Intel Quiet Thermal TechnologyY
Intel Efficient Power TechnologyY
Intel Server Customization TechnologyY
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