Intel Celeron 3765U processor 1.9 GHz 2 MB L3

Intel Celeron 3765U. Processor family: Intel® Celeron®, Processor socket: BGA 1168, Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 16 GB, Memory types supported by processor: DDR3L-SDRAM,LPDDR3-SDRAM. On-board graphics card model: Intel® HD Graphics, On-board graphics card outputs supported: DisplayPort,HDMI,Embedded DisplayPort (eDP), On-board graphics card base frequency: 300 MHz. Market segment: Mobile, Use conditions: Embedded Broad Market Commercial Temp,Industrial Commercial Temp,PC/Client/Tablet, PCI Express configurations: 4x1,2x4. Package dimensions (WxDxH): 1.57 x 0.945 x 0.0512" (40 x 24 x 1.3 mm), Processor package size: 40mm x 24mm x 1.3mm
Manufacturer: INTEL
Availability: Out of Stock - on backorder and will be dispatched once in stock.
SKU: 5368473
Manufacturer part number: FH8065801620803
Vendor: Synnex
$116.88
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Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Idle States Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Products specifications
Attribute nameAttribute value
Maximum Memory16 GB
Market segmentMobile
Processor brand nameIntel Celeron
Product familyIntel Celeron Processor
Cache memory2 MB
Born on dateQ2'15
Features
Product typeSystem on Chip
Processor
Processor cache2048 KB
PCI Express configurations4x1,2x4
SteppingF0
Maximum internal memory supported by processor16 GB
Processor special features
Intel® AES New Instructions (Intel® AES-NI)N
Memory types supported by processorDDR3L-SDRAM,LPDDR3-SDRAM
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Products specifications
Attribute nameAttribute value
Maximum Memory16 GB
Market segmentMobile
Processor brand nameIntel Celeron
Product familyIntel Celeron Processor
Cache memory2 MB
Born on dateQ2'15
Features
Product typeSystem on Chip
Processor
Processor cache2048 KB
PCI Express configurations4x1,2x4
SteppingF0
Maximum internal memory supported by processor16 GB
Processor special features
Intel® AES New Instructions (Intel® AES-NI)N
Memory types supported by processorDDR3L-SDRAM,LPDDR3-SDRAM
Product tags
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